Studies on Strain Distribution Measurement using Digital Image Correlation Method
نویسندگان
چکیده
منابع مشابه
Non-linear analyses of strain in flip chip packages improved by the measurement using the digital image correlation method
Numerical methods like the finite element (FE) method are often used to evaluate the reliability of electronic packages. However, the accuracy of non-linear numerical analyses should be confirmed by experimental measurements. In this study, we evaluated the strain distribution in flip chip (FC) packages with multi-layered printed circuit boards (PCBs) by combining the digital image correlation ...
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ژورنال
عنوان ژورنال: Journal of the Japan Society for Precision Engineering
سال: 2007
ISSN: 1882-675X,0912-0289
DOI: 10.2493/jjspe.73.659